The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2014

Filed:

Jan. 31, 2012
Applicants:

Takahiko Furuta, Kasugai, JP;

Toru Itabashi, Anjo, JP;

Yuuki Mikami, Kariya, JP;

Naoki Tanimoto, Kariya, JP;

Hiroaki Nakamura, Nagaokakyo, JP;

Shigeki Nishiyama, Nagaokakyo, JP;

Inventors:

Takahiko Furuta, Kasugai, JP;

Toru Itabashi, Anjo, JP;

Yuuki Mikami, Kariya, JP;

Naoki Tanimoto, Kariya, JP;

Hiroaki Nakamura, Nagaokakyo, JP;

Shigeki Nishiyama, Nagaokakyo, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02H 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, and a heat release portion. The interrupt wire melts in accordance with heat generated by an overcurrent. The heat release portion is attached to the common wire and is disposed at a position where a wiring distance from the interrupt wire is shorter than a wiring distance between the interrupt wire and any of the electronic components except for one of the electronic components mounted on the one of the component-mounted wires.


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