The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2014
Filed:
Sep. 16, 2008
Applicants:
Mark Bachman, Sinking Spring, PA (US);
John W. Osenbach, Kutztown, PA (US);
Inventors:
Mark Bachman, Sinking Spring, PA (US);
John W. Osenbach, Kutztown, PA (US);
Assignee:
Agere Systems LLC, Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
Abstract
An electronic device, comprising a semiconductor substrate having a first metal pad formed thereover, a device package substrate having a second metal pad formed thereover, and, a doped solder bump. The doped solder bump is located between and in contact with said first and second metal pads. The doped solder bump consisting of Sn, one or both of Ag and Cu, and a fourth row transition metal dopant in a concentration range from 0.35 wt. % to 2 wt. %.