The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2014
Filed:
May. 13, 2010
Gi Ho Jeong, Busan, KR;
SI Young Yang, Anyang-si, KR;
Jae Wook Kwon, Seoul, KR;
Jeong Hoon Park, Gyunggi-do, KR;
Hyun Ju Yi, Seoul, KR;
Choon Keun Lee, Gyunggi-do, KR;
Gi Ho Jeong, Busan, KR;
Si Young Yang, Anyang-si, KR;
Jae Wook Kwon, Seoul, KR;
Jeong Hoon Park, Gyunggi-do, KR;
Hyun Ju Yi, Seoul, KR;
Choon Keun Lee, Gyunggi-do, KR;
Samsung Electronics Co., Ltd., Suwon-Si, KR;
Abstract
Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 μm or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.