The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2014

Filed:

Mar. 14, 2012
Applicants:

Thomas M. Goida, Windham, NH (US);

Jicheng Yang, North Andover, MA (US);

Inventors:

Thomas M. Goida, Windham, NH (US);

Jicheng Yang, North Andover, MA (US);

Assignee:

Analog Devices, Inc., Norwood, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); H04R 25/00 (2006.01); H01L 21/00 (2006.01); H04R 19/04 (2006.01); H01L 23/10 (2006.01); H01L 23/12 (2006.01); H01L 21/52 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); H01L 23/10 (2013.01); H01L 23/12 (2013.01); H01L 21/52 (2013.01); H01L 2924/1433 (2013.01);
Abstract

Integrated devices and methods for packaging the same can include an external housing, an internal housing positioned within the external housing, and an external cavity formed between the external housing and the internal housing. An integrated device die can be positioned within the external cavity in fluid communication with an internal cavity formed by the internal lid. An air way can extend through the external cavity to the internal cavity, and can further extend from the internal cavity to the external cavity. The air way can provide fluid communication between the package exterior and the integrated device die, while reducing contamination of the integrated device die.


Find Patent Forward Citations

Loading…