The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2014

Filed:

Mar. 23, 2012
Applicants:

Kazutoshi Tsuyutani, Tokyo, JP;

Yoshihiro Suzuki, Tokyo, JP;

Inventors:

Kazutoshi Tsuyutani, Tokyo, JP;

Yoshihiro Suzuki, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/18 (2006.01); H01L 23/485 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H01L 23/485 (2013.01); H05K 3/32 (2013.01);
Abstract

An electronic component or the like is mounted on a substrate, and on the electronic component, an insulating layer is provided. Afterward, via-holes V are made in the insulating layer on terminals of the electronic component. Each of the terminals of the electronic component has, for example, a laminate structure of a first metal layer, a second metal layer and a third metal layer. When the via-holes V are formed, part of the third metal layer having a comparatively high electric resistance is removed, and the corresponding portion is connected to a wiring layer including via-conductors. Moreover, the third metal layer excellent in close contact properties with the insulating layer is preferably used.


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