The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2014

Filed:

Sep. 23, 2011
Applicants:

Yoshihide Wadayama, Hitachiota, JP;

Katsumi Ohata, Tsuchiura, JP;

Kazuhiko Nakagawa, Tsuchiura, JP;

Morio Kimura, Kasumigaura, JP;

Inventors:

Yoshihide Wadayama, Hitachiota, JP;

Katsumi Ohata, Tsuchiura, JP;

Kazuhiko Nakagawa, Tsuchiura, JP;

Morio Kimura, Kasumigaura, JP;

Assignee:

SH Copper Products Co., Ltd., Tsuchiura, Ibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 39/24 (2006.01);
U.S. Cl.
CPC ...
Abstract

A precursor for a NbSn superconductor wire to be manufactured by the internal diffusion method. The precursor includes Nb-based single core wires, Sn-based single core wires, and a cylindrical diffusion barrier made of Ta or Nb. Each Nb-based single core wire includes a Nb-based core coated with a Cu-based coating made of a Cu-based matrix. Each Sn-based single core wire includes a Sn-based core coated with a Cu-based coating made of a Cu-based matrix. The Nb-based single core wires and the Sn-based single core wires are regularly disposed in the diffusion barrier. The Nb-based single core wires includes at least two kinds of Nb-based single core wires having different Cu/Nb ratios and the Cu/Nb ratio is a cross sectional area ratio of the Cu-based coating to the Nb-based core.


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