The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2014
Filed:
Jul. 21, 2011
Ju-il Choi, Suwon-si, KR;
Kyu-ha Lee, Yongin-si, KR;
Jae-hyun Phee, Incheon, KR;
Jung-hwan Kim, Bucheon-si, KR;
Tae Hong Min, Gumi-si, KR;
Ju-il Choi, Suwon-si, KR;
Kyu-Ha Lee, Yongin-si, KR;
Jae-hyun Phee, Incheon, KR;
Jung-Hwan Kim, Bucheon-si, KR;
Tae Hong Min, Gumi-si, KR;
Abstract
Provided is a method of forming a semiconductor package including providing a substrate having a first side and an opposite second side and providing a wafer having a plurality of semiconductor chips, each of the semiconductor chips having a conductive pad, wherein at least one of the substrate and the wafer includes a seed pattern. The first side of the substrate is bonded to the wafer with the conductive pad positioned adjacent to the first side of the substrate and the seed pattern positioned between the conductive pad and the first side of the substrate. A through hole is then formed penetrating the substrate from the second side of the substrate to expose the seed pattern. A through electrode is formed in the through hole using the seed pattern as a seed. Corresponding devices are also provided.