The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2014

Filed:

Nov. 05, 2010
Applicants:

Philip Yi Zhi Chu, Monrovia, CA (US);

Stanley Tafeng Kao, Torrance, CA (US);

Lev Katsenelenson, Los Angeles, CA (US);

Inventors:

Philip Yi Zhi Chu, Monrovia, CA (US);

Stanley Tafeng Kao, Torrance, CA (US);

Lev Katsenelenson, Los Angeles, CA (US);

Assignee:

Luminit LLC, Torrance, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
Abstract

Encapsulated LEDs can be made by taking a mold tool defining a cavity that defines a lens shape and providing a patterned release film defining the inverse of a microstructure in a surface of the film. The patterned release film is conformed to the cavity of the mold tool. An LED chip is placed in a spaced relationship from the patterned release film in the cavity. A resin is then introduced into the space between the LED chip and the patterned release film in the cavity. The resin is cured in the space between the LED chip and the patterned release film in the cavity while contact is maintained between the patterned release film and the curing resin. The encapsulated LED is then freed from the mold tool and the patterned release film.


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