The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2014
Filed:
Jul. 04, 2007
Applicant:
Tadahiro Kimura, Hitachi, JP;
Inventor:
Tadahiro Kimura, Hitachi, JP;
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C09K 13/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed is a polishing slurry for CMP which makes it possible to polish a barrier layer, a wiring metal layer and an interlayer dielectric continuously, and restrain a phenomenon that the interlayer dielectric in a region near the wiring metal layer is excessively shaven off so that a depression is generated. A polishing slurry, for CMP, containing abrasive particles, an acid, a tolyltriazole compound represented by the following general formula (I), and water: wherein Rs each independently represent an alkylene group having 1 to 4 carbon atoms, and Rrepresents an alkylene group having 1 to 4 carbon atoms.