The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2014
Filed:
Mar. 31, 2011
Masatoshi Sakurai, Tokyo, JP;
Takuya Shimada, Kawasaki, JP;
Shinobu Sugimura, Yokohama, JP;
Satoshi Shirotori, Yokohama, JP;
Masatoshi Sakurai, Tokyo, JP;
Takuya Shimada, Kawasaki, JP;
Shinobu Sugimura, Yokohama, JP;
Satoshi Shirotori, Yokohama, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
According to one embodiment, a stamper manufacturing method comprises electroless plating by using a master includes a substrate, a conductive underlayer formed on the substrate and having catalytic activity, projecting patterns having no catalytic activity and partially formed on a surface of the conductive underlayer having catalytic activity, and regions in which the conductive underlayer having catalytic activity is exposed between the projecting patterns to deposit selectively an amorphous conductive layer between the projecting patterns and in the regions in which the conductive underlayer is exposed, and forming stamper projections, electroplating on the stamper projections includes the projecting patterns and the amorphous conductive layer by using the amorphous conductive layer and the conductive underlayer as electrodes to form a stamper main body made of a crystalline metal, and releasing a stamper includes the stamper projections and the stamper main body from the master.