The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2014
Filed:
Jun. 22, 2010
Masakatsu Urairi, Ibaraki, JP;
Atsushi Hino, Ibaraki, JP;
Naoyuki Matsuo, Ibaraki, JP;
Tomokazu Takahashi, Ibaraki, JP;
Takeshi Matsumura, Ibaraki, JP;
Syouji Yamamoto, Ibaraki, JP;
Masakatsu Urairi, Ibaraki, JP;
Atsushi Hino, Ibaraki, JP;
Naoyuki Matsuo, Ibaraki, JP;
Tomokazu Takahashi, Ibaraki, JP;
Takeshi Matsumura, Ibaraki, JP;
Syouji Yamamoto, Ibaraki, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
A manufacturing method of laser processed parts in which at least a pressure-sensitive adhesive layer is provided on a base material as a pressure-sensitive adhesive sheet for laser processing, using a material having specified physical properties. This method comprises adhering the pressure-sensitive adhesive sheet for laser processing to the laser beam exit side of the work by way of the pressure-sensitive adhesive layer, processing the work by irradiating the work with a laser beam of within 2 times of the irradiation intensity for forming a through-hole in the work, at higher than the irradiation intensity of threshold for inducing ablation of the work, and peeling the pressure-sensitive adhesive sheet for laser processing from the work after the machining. Therefore, contamination of the work surface by decomposition products can be effectively suppressed, and laser processed parts can be manufactured easily and at high production efficiency.