The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2014

Filed:

Jul. 21, 2010
Applicants:

Ki Jong Kim, Daejeon-si, KR;

Yong Min Yoo, Cheonan-si, KR;

Jung Soo Kim, Cheonan-si, KR;

Hyung Sang Park, Seoul, KR;

Seung Woo Choi, Cheonan-si, KR;

Jeong Ho Lee, Seoul, KR;

Dong Rak Jung, Cheonan-si, KR;

Inventors:

Ki Jong Kim, Daejeon-si, KR;

Yong Min Yoo, Cheonan-si, KR;

Jung Soo Kim, Cheonan-si, KR;

Hyung Sang Park, Seoul, KR;

Seung Woo Choi, Cheonan-si, KR;

Jeong Ho Lee, Seoul, KR;

Dong Rak Jung, Cheonan-si, KR;

Assignee:

ASM Genitech Korea Ltd., Cheonan-Si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/00 (2006.01); C23C 16/46 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45544 (2013.01); C23C 16/466 (2013.01); C23C 16/45504 (2013.01); C23C 16/4584 (2013.01);
Abstract

A deposition apparatus according to an exemplary embodiment of the present invention is a lateral-flow deposition apparatus in which in which a process gas flows between a surface where a substrate is disposed and the opposite surface, substantially in parallel with the substrate. The lateral-flow deposition apparatus includes: a substrate support that moves up/down and rotates the substrate while supporting the substrate; a reactor cover that defines a reaction chamber by contacting the substrate support; and a substrate support lifter and a substrate support rotator that move the substrate support.


Find Patent Forward Citations

Loading…