The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2014

Filed:

Feb. 28, 2011
Applicants:

Christopher Ward, Mol, BE;

Craig Gendreau, Spokane, WA (US);

Inventors:

Christopher Ward, Mol, BE;

Craig Gendreau, Spokane, WA (US);

Assignee:

J&L Group International, LLC, Keithville, LA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B25J 15/00 (2006.01); B65G 57/24 (2006.01); B65G 57/00 (2006.01); B25J 17/02 (2006.01); B65H 31/30 (2006.01); B65G 47/08 (2006.01); B25J 15/02 (2006.01); B65G 47/90 (2006.01); B65G 57/26 (2006.01); B65G 61/00 (2006.01);
U.S. Cl.
CPC ...
B25J 15/0052 (2013.01); B65G 57/24 (2013.01); B65G 57/00 (2013.01); B25J 17/0241 (2013.01); B65H 31/3081 (2013.01); B65G 47/086 (2013.01); B65G 2814/0307 (2013.01); B25J 15/0253 (2013.01); B65G 47/907 (2013.01); B65G 57/26 (2013.01); B65G 61/00 (2013.01); B25J 15/0061 (2013.01); Y10S 414/114 (2013.01);
Abstract

A method of forming layered stacks of bundles includes providing a gripping appliance comprising a first gripping assembly and a second gripping assembly. The first gripping assembly is configured for grasping one or more first bundles and the second gripping assembly is configured for grasping one or more second bundles. The first and second gripping assemblies are configured such that first and second bundles grasped thereby may be reoriented relative to one another. The method further includes retrieving from a first location one or more first bundles with the first gripping assembly and one or more second bundles with the second gripping assembly and transporting the first and second bundles to a second location, During transport of the first and second bundles, the bundles are reoriented relative to one another. The bundles are deposited at a selected position in the second location to form at least a partial layer of a layered stack of bundles.


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