The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2014

Filed:

Feb. 23, 2011
Applicants:

Hilmar Von Campe, Mainz, DE;

Stefan Meyer, Ronneburg, DE;

Thai Huynh-minh, Hanau, DE;

Stephan Huber, Rechtmehring, DE;

Silvio Reiff, Aschaffenburg, DE;

Inventors:

Hilmar Von Campe, Mainz, DE;

Stefan Meyer, Ronneburg, DE;

Thai Huynh-Minh, Hanau, DE;

Stephan Huber, Rechtmehring, DE;

Silvio Reiff, Aschaffenburg, DE;

Assignee:

Schott Solar AG, Mainz, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/10 (2006.01); B23K 1/00 (2006.01); H01L 31/05 (2014.01); H01L 31/0224 (2006.01); B23K 3/06 (2006.01); B23K 1/06 (2006.01);
U.S. Cl.
CPC ...
B23K 1/06 (2013.01); B23K 1/0016 (2013.01); H01L 31/0504 (2013.01); H01L 31/022425 (2013.01); B23K 3/0607 (2013.01); Y02E 10/50 (2013.01);
Abstract

The invention concerns a method and an apparatus for the application of solder onto a work piece, wherein the solder is soldered on at a soldering temperature Tand subject to the influence of ultrasound. In order to be able to solder without difficulties the solder onto work pieces that exhibit sensitivity to breakage it is proposed that the solder is heated, is applied to the work piece that is supported in particular in a spring-mounted manner, and is soldered-on subject to the influence of ultrasound.


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