The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2014
Filed:
Dec. 22, 2010
Applicants:
Tetsuya Endo, Komae, JP;
Einstein Noel Abarra, Hachioji, JP;
Inventors:
Tetsuya Endo, Komae, JP;
Einstein Noel Abarra, Hachioji, JP;
Assignee:
Canon Anelva Corporation, Kanagawa-Ken, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25D 23/12 (2006.01); H05K 7/20 (2006.01); F25D 25/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20009 (2013.01); H05K 7/20372 (2013.01); H05K 7/20545 (2013.01); F25D 25/027 (2013.01);
Abstract
A cooling system that cools a wafer in a vacuum chamber of a sputtering apparatus, includes a wafer cooling stage for cooling the wafer, a cooling mechanism for cooling the wafer cooling stage, cooling gas supply units which introduces a cooling gas to the wafer cooling stage, a wafer rotating mechanism which holds the wafer in a state separated from the wafer cooling stage by a predetermined gap, and is rotated while holding the wafer, and a driving mechanism which rotates the wafer rotating mechanism at a predetermined rotational speed.