The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8776361 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 15, 2014

Filed:

Nov. 30, 2010
Applicant:

Stefan Buhler, Danikon, CH;

Inventor:

Stefan Buhler, Danikon, CH;

Assignee:

Textilma AG, , CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01); G06K 19/077 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H05K 13/04 (2013.01); G06K 19/07718 (2013.01); G06K 19/07749 (2013.01);
Abstract

A mounting system for applying an RFID chip module having at least one electrical connection to a substrate having at least one conductor, in particular a label. The system includes a stamping device for stamping out the RFID chip module from a carrier strip having a plurality of chip modules. The stamping device comprises a stamping die having a stamping opening, by which an RFID chip module to be stamped out is received with accurate positioning, and a stamping punch is disposed above the stamping opening A support for receiving a substrate with accurate positioning is disposed below the stamping opening and the stamping punch can be moved up against the substrate. A suction device is provided for holding the RFID chip module on the stamping punch. A heating device for melting solder is present on the RFID chip module in order to establish a conductive connection between an electrical connection of the RFID chip module and a conductor of the substrate.


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