The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2014

Filed:

Nov. 17, 2010
Applicant:

Charles Edward Baumgartner, Niskayuna, NY (US);

Inventor:

Charles Edward Baumgartner, Niskayuna, NY (US);

Assignee:

General Electric Company, Niskayuna, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 3/02 (2006.01); H01L 41/22 (2013.01); H01L 41/25 (2013.01); H03H 3/08 (2006.01); H03H 3/10 (2006.01); B06B 1/06 (2006.01); G01N 29/00 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
H01L 41/22 (2013.01); H01L 41/25 (2013.01); H03H 3/08 (2013.01); H03H 3/10 (2013.01); B06B 1/0622 (2013.01); B06B 1/0629 (2013.01); G01N 29/00 (2013.01); B32B 38/0004 (2013.01);
Abstract

A method of fabricating a plurality of ultrasound transducer assemblies is provided. The method includes applying one or more layers of patternable material to at least a portion of a surface of a wafer comprising a number of die. The method further includes patterning the patternable material to define a plurality of openings, where each of the openings is aligned with a respective one of the die, disposing ultrasound acoustic arrays in respective ones of the openings, coupling the ultrasound acoustic arrays to the respective die to form the respective ultrasound transducer assemblies, and separating the ultrasound transducer assemblies to form individual ultrasound transducer assemblies.


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