The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2014
Filed:
Jan. 31, 2012
Toru Itabashi, Anjo, JP;
Yuuki Mikami, Kariya, JP;
Takahiko Furuta, Kasugai, JP;
Ryoichi Shiraishi, Obu, JP;
Hiroaki Nakamura, Nagaokakyo, JP;
Shigeki Nishiyama, Nagaokakyo, JP;
Toru Itabashi, Anjo, JP;
Yuuki Mikami, Kariya, JP;
Takahiko Furuta, Kasugai, JP;
Ryoichi Shiraishi, Obu, JP;
Hiroaki Nakamura, Nagaokakyo, JP;
Shigeki Nishiyama, Nagaokakyo, JP;
DENSO CORPORATION, Kariya, JP;
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Abstract
An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, a connection wire via which the interrupt wire is coupled with one of the common wire and the one of the component-mounted wires, and a solder disposed between each of the electronic components and a corresponding one of the component-mounted wires and having a lower melting point than the interrupt wire. The interrupt wire is configured to melt in accordance with heat generated by an overcurrent so as to interrupt a coupling between the one of the component-mounted wires and the common wire.