The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2014
Filed:
May. 23, 2012
Wen-yuan LI, Hsin-Chu, TW;
Pin-hsiang Chiu, Hsin-Chu, TW;
Yu-chieh Hsueh, Hsin-Chu, TW;
Li-yin Chen, Hsin-Chu, TW;
Min-chih Wei, Hsin-Chu, TW;
Shiuan-iou Lin, Hsin-Chu, TW;
Wen-Yuan Li, Hsin-Chu, TW;
Pin-Hsiang Chiu, Hsin-Chu, TW;
Yu-Chieh Hsueh, Hsin-Chu, TW;
Li-Yin Chen, Hsin-Chu, TW;
Min-Chih Wei, Hsin-Chu, TW;
Shiuan-Iou Lin, Hsin-Chu, TW;
AU Optronics Corp., Science-Based Industrial Park, Hsin-Chu, TW;
Abstract
A method of manufacturing a flexible substrate structure includes the following steps. A first loading substrate having a center area and a peripheral area is provided. A first adhesive layer is formed on the center area of the first loading substrate, and a second adhesive layer is formed on the peripheral area of the first loading substrate. The first flexible substrate is adhered to the first loading substrate by the first adhesive layer and the second adhesive layer to form a flexible substrate structure, wherein the adhesive force between the first flexible substrate and the second adhesive layer is stronger than that between the first flexible substrate and the first adhesive layer. The flexible substrate structure is cut, and the first flexible substrate is separated from the flexible substrate structure.