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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8772953 B1

PDFFull Text
Date of Patent:
Jul. 08, 2014

Filed:

Mar. 13, 2009

Semiconductor device and programming method

Applicants:

Koji Taya, Kanagawa, JP;

Masanori Onodera, Kanagawa, JP;

Junji Tanaka, Kanagawa, JP;

Kouichi Meguro, Kanagawa, JP;

Inventors:

Koji Taya, Kanagawa, JP;

Masanori Onodera, Kanagawa, JP;

Junji Tanaka, Kanagawa, JP;

Kouichi Meguro, Kanagawa, JP;

Assignee:

Spansion LLC, Sunnyvale, CA (US);

Attorney:
Primary Examiner:

Matthew W Such

Assistant Examiner:

Krista Soderholm

Int. Cl.
CPC ...
H01L 23/48 (2006.01); B29C 45/16 (2006.01); H01L 23/28 (2006.01); B29C 45/02 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/552 (2006.01); B29C 45/14 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); B29C 45/1671 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/01006 (2013.01); H01L 2225/0651 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/1815 (2013.01); H01L 23/28 (2013.01); B29C 45/02 (2013.01); H01L 23/3135 (2013.01); H01L 2924/3025 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2924/01013 (2013.01); H01L 2224/85399 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01005 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/15311 (2013.01); H01L 23/552 (2013.01); H01L 21/565 (2013.01); B29C 45/14655 (2013.01); H01L 2224/32145 (2013.01); H01L 24/48 (2013.01); H01L 2924/00014 (2013.01); H01L 23/3128 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/014 (2013.01);
Abstract

The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.

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