The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2014
Filed:
Dec. 14, 2011
Koji Noda, Chiryu, JP;
Satoshi Sakimichi, Anjo, JP;
Masahiro Sakamoto, Kariya, JP;
Kimio Kohara, Nagoya, JP;
Koji Noda, Chiryu, JP;
Satoshi Sakimichi, Anjo, JP;
Masahiro Sakamoto, Kariya, JP;
Kimio Kohara, Nagoya, JP;
DENSO CORPORATION, Kariya, JP;
Nippon Soken, Inc., Nishio, JP;
Abstract
A bonding structure includes a first member, a second member and a bonding member. The first member has a plate shape and is made of a carbon-base material. The first member serves as a heat diffusion member that transfers heat at least in a thickness direction, which is perpendicular to a plane of the plate shape. The second member is bonded to the first member through the bonding member. The first member has a metal thin film at least on an opposed surface that is opposed to the second member. The bonding member is disposed between the opposed surface of the first member and the second member. The bonding member is provided by a sintered body of metal particle. For example, the bonding structure is employed in a cooling unit including a heat source.