The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2014

Filed:

Dec. 21, 2010
Applicants:

Shotaro Miyawaki, Nukata-gun, JP;

Katsuhiko Kawashima, Nukata-gun, JP;

Atsushi Kashiwazaki, Anjo, JP;

Takashi Yoshimizu, Kariya, JP;

Inventors:

Shotaro Miyawaki, Nukata-gun, JP;

Katsuhiko Kawashima, Nukata-gun, JP;

Atsushi Kashiwazaki, Anjo, JP;

Takashi Yoshimizu, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/50 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3121 (2013.01); H01L 2224/48247 (2013.01); H01L 23/49531 (2013.01); H01L 23/562 (2013.01); H01L 23/49541 (2013.01); H01L 23/4334 (2013.01);
Abstract

An electronic device includes a heat sink, a substrate mounted on the heat sink, a coating layer formed on the substrate, a lead frame fixed to the heat sink, and a mold resin sealing the substrate and the lead frame. The coating layer is made of one of a polyimide-based resin and a polyamideimide-based resin. The lead frame has a fixing terminal fixed to the heat sink through an adhesive layer. The adhesive layer is made of the same material as the coating layer.


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