The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8772070 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 08, 2014

Filed:

Sep. 02, 2009
Applicant:

Miyuki Watanabe, Isehara, JP;

Inventor:

Manjirou Watanabe, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for manufacturing solid-state imaging device for collectively manufacturing a multiplicity of solid-state imaging devices at a wafer level, the method including: a step of reducing the thickness of a cover glass wafer () after providing a mask material () to the cover glass wafer () including frame-shaped spacers (); a step of releasing the mask material () and laminating a first support wafer () through a lamination member (); a step of positioning and bonding a silicon wafer () and the cover glass wafer (), the silicon wafer () including a second support wafer () laminated on the back side through a lamination member (); a step of dicing the cover glass wafer () into cover glasses () by a whetstone (); and a step of dicing the silicon wafer () by a whetstone ().


Find Patent Forward Citations

Watanabe, Manjirou. (2014). Method for manufacturing solid-state imaging device (U.S. Patent No. 8772070). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8772070

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