The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2014

Filed:

May. 06, 2010
Applicants:

Klaus Keite-telgenbüscher, Hamburg, DE;

Jan Ellinger, Hamburg, DE;

Thortsten Krawinkel, Hamburg, DE;

Alexander Steen, Bonn, DE;

Inventors:

Klaus Keite-Telgenbüscher, Hamburg, DE;

Jan Ellinger, Hamburg, DE;

Thortsten Krawinkel, Hamburg, DE;

Alexander Steen, Bonn, DE;

Assignee:

tesa SE, Hamburg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/40 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which an at least partly crosslinked hotmelt adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.


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