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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8771456 B1

PDFFull Text
Date of Patent:
Jul. 08, 2014

Filed:

Mar. 08, 2013

Method of manufacturing a semiconductor device and substrate separating apparatus

Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Noriko Shimizu, Yokohama, JP;

Shinya Takyu, Shiraoka, JP;

Assignee:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Attorney:

Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Sing P Chan

Int. Cl.
CPC ...
B29C 65/52 (2006.01); B29C 65/54 (2006.01); B29C 63/48 (2006.01); B32B 37/12 (2006.01); B32B 37/26 (2006.01); B32B 38/10 (2006.01); B32B 43/00 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); B29C 65/02 (2006.01); B29C 65/48 (2006.01); B29C 65/00 (2006.01); B32B 7/06 (2006.01); B32B 38/00 (2006.01); B32B 38/18 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67092 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); B29C 65/02 (2013.01); B29C 65/48 (2013.01); B29C 66/004 (2013.01); B32B 7/06 (2013.01); B32B 37/26 (2013.01); B32B 38/0004 (2013.01); B32B 38/10 (2013.01); B32B 38/185 (2013.01); B32B 43/006 (2013.01);
Abstract

According to one embodiment, there is disclosed a method of manufacturing a semiconductor device forming a release layer on a region excluding a peripheral edge portion of a surface of a first substrate, bonding a second substrate to at least a region including the release layer of the surface of the first substrate via an adhesive layer, removing physically a peripheral edge portion of the second substrate in a manner that at least a surface of the adhesive layer right under the peripheral edge portion of the second substrate is exposed, the adhesive layer is caused to remain between the peripheral edge portion of the first substrate and the second substrate, and adhesion between the first and second substrates is maintained, and then dissolving the adhesive layer.

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