The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2014

Filed:

Jul. 23, 2010
Applicants:

Nobuhito Suehira, Kawasaki, JP;

Junichi Seki, Yokohama, JP;

Masao Majima, Isehara, JP;

Atsunori Terasaki, Kawasaki, JP;

Hideki Ina, Utsunomiya, JP;

Inventors:

Nobuhito Suehira, Kawasaki, JP;

Junichi Seki, Yokohama, JP;

Masao Majima, Isehara, JP;

Atsunori Terasaki, Kawasaki, JP;

Hideki Ina, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B28B 17/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A pattern forming method for forming an imprinted pattern on a coating material disposed on a substrate with a pattern provided to a mold. The method includes preparing a mold provided with a first surface including a pattern area, a second surface located opposite from the first surface, and an alignment mark provided at a position at which the alignment mark is away from the first surface, contacting the pattern area of the mold with the coating material disposed on the substrate, obtaining information about positions of the mold and the substrate by using the alignment mark and a mark provided to the substrate in a state in which the coating material is disposed on the substrate at a portion where the alignment mark and the substrate are opposite to each other, and effecting alignment of the substrate with the mold in an in-plane direction of the pattern area, on the basis of the information in a state in which the pattern area and the coating material contact each other.


Find Patent Forward Citations

Loading…