The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2014

Filed:

Nov. 27, 2012
Applicant:

Zf Friedrichshafen Ag, Friedrichshafen, DE;

Inventors:

Herbert Wallner, Auerbach, DE;

Roland Friedl, Auerbach, DE;

Assignee:

ZF Friedrichshafen AG, Friedrichshafen, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01M 13/02 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); H05K 2201/10303 (2013.01); H05K 2203/1316 (2013.01); G01M 13/02 (2013.01); H05K 2201/10151 (2013.01);
Abstract

A method of producing an insert molded sensor assembly having at least one sensor element accommodated on a first side of a circuit board of the sensor assembly. During a first step, a plurality of pins are introduced and penetrate through the circuit board. The circuit board, including the at least one sensor element, is then disposed, during a second step, into a two-part insert mold tool so that the pins are supported on both sides of the circuit board in a direction transverse to a plane defined by the circuit board. A defined spacing distance, between a surface of the sensor element and the insert mold tool, is produced by the pins. During a third step of the method, the insert mold tool is filled with insert molding material, particularly a duroplast.


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