The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2014

Filed:

Nov. 27, 2013
Applicant:

Coretech System Co., Ltd., Chupei, TW;

Inventors:

Rong Yeu Chang, Chupei, TW;

Chia Hsiang Hsu, Chupei, TW;

Hsien Sen Chiu, Chupei, TW;

Shih Po Sun, Chupei, TW;

Chen Chieh Wang, Chupei, TW;

Huan Chang Tseng, Chupei, TW;

Assignee:

Coretech System Co., Ltd., Chupei, Hsinchu County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/76 (2006.01); G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
B29C 45/7693 (2013.01); G06F 17/5018 (2013.01); B29C 2945/76588 (2013.01); B29C 2945/7605 (2013.01); B29C 2945/76103 (2013.01);
Abstract

A computer-implemented method and non-transitory computer medium for calculating a shrinkage of a molding product comprises a step of using a computer processor to calculate a molding pressure of a molding fluid in a molding cavity by taking into consideration an increase of a shear viscosity of the molding fluid by a decrease of a shear rate, and a step of calculating the shrinkage of the molding products by taking into consideration a variation of a specific volume of the molding fluid as the molding pressure and a molding temperature decrease.


Find Patent Forward Citations

Loading…