The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2014

Filed:

Oct. 03, 2011
Applicant:

Cheng-tang Wu, Livermore, CA (US);

Inventor:

Cheng-Tang Wu, Livermore, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 7/60 (2006.01); G06F 17/10 (2006.01); G06F 17/50 (2006.01); G06T 17/20 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5018 (2013.01); G06T 17/20 (2013.01); G01N 2203/0216 (2013.01); G06F 2217/16 (2013.01); G06F 2217/44 (2013.01);
Abstract

Methods and systems for numerically simulating structural behaviors of embedded bi-materials are disclosed. At least first and second grid models are created independently for an embedded bi-material that contains an immersed material embedded entirely within a base material. First group of meshfree nodes represents the entire domain (i.e., base plus immersed materials). Second group of meshfree nodes represents the immersed or embedded material, which includes all interface nodes and nodes located within a space bordered by the material interface. Numerical structural behaviors of the embedded bi-material are simulated using the first and second set of meshfree nodes with a meshfree method that combines two meshfree approximations. The first meshfree approximation covers the first set of meshfree nodes and is based on properties of the base material, while the second meshfree approximation covers the second set of meshfree nodes and is based on a differential between the immersed and base materials.


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