The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2014
Filed:
Aug. 08, 2012
Myung Jun Park, Chungcheongbuk-do, KR;
Sang Hoon Kwon, Gyunggi-do, KR;
Jae Young Park, Seoul, KR;
Kyu Ha Lee, Gyunggi-do, KR;
Byung Jun Jeon, Seoul, KR;
Da Young Choi, Gyunggi-do, KR;
Hyun Hee Gu, Gyunggi-do, KR;
Chang Hoon Kim, Gyunggi-do, KR;
Myung Jun Park, Chungcheongbuk-do, KR;
Sang Hoon Kwon, Gyunggi-do, KR;
Jae Young Park, Seoul, KR;
Kyu Ha Lee, Gyunggi-do, KR;
Byung Jun Jeon, Seoul, KR;
Da Young Choi, Gyunggi-do, KR;
Hyun Hee Gu, Gyunggi-do, KR;
Chang Hoon Kim, Gyunggi-do, KR;
Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do, KR;
Abstract
There are provided a multilayer ceramic electronic component, and a method of fabricating the same. The multilayer ceramic electronic component includes: a ceramic main body including a dielectric layer; first and second internal electrodes disposed to face each other within the ceramic main body; and a first external electrode and a second external electrode, wherein the first and second external electrodes include a conductive metal and glass, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of the glass in a central part thereof is 35% to 80% of the total area of the central part. A multilayer ceramic electronic component having improved reliability may be implemented by enhancing chip air-tightness.