The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2014

Filed:

Sep. 07, 2012
Applicant:

Seung-min OH, Gyeonggi-do, KR;

Inventor:

Seung-Min Oh, Gyeonggi-do, KR;

Assignee:

SK Hynix Inc., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03K 19/094 (2006.01); H03K 19/20 (2006.01); H03K 3/00 (2006.01); H03B 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit chip includes a first single ended type buffer configured to receive a first signal through a first pad, a second single ended type buffer configured to receive a second signal through a second pad, a differential type buffer configured to receive a third signal through the first pad and the second pad, a strobe input unit configured to receive a strobe signal synchronized with the third signal inputted to the first pad and the second pad, and a buffer control unit configured to control activation of the first and second single ended type buffers and the differential type buffer in response to the strobe signal.


Find Patent Forward Citations

Oh, Seung-Min. (2014). Integrated circuit chip (U.S. Patent No. 8766668). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8766668

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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