Semiconductor device and method for manufacturing the same

Abstract

A first thin film diode (A) has a first semiconductor layer (A) and a first light blocking layer (A) disposed on the substrate side of the first semiconductor layer. A second thin film diode (B) has a second semiconductor layer (B) and a second light blocking layer (B) disposed on the substrate side of the second semiconductor layer. An insulating film () is formed between the first semiconductor layer (A) and the first light blocking layer (A) and between the second semiconductor layer (B) and the second light blocking layer (B). A thickness Dof a portion of the insulating film () positioned between the first semiconductor layer (A) and the first light blocking layer (A) is different from a thickness Dof a portion of the insulating film () positioned between the second semiconductor layer (B) and the second light blocking layer (B). The intensity of light in a first wavelength region incident on the first semiconductor layer (A) is higher than the intensity of light in the first wavelength region incident on the second semiconductor layer (B). The intensity of light in a second wavelength region including a wavelength longer than the maximum wavelength of the first wavelength region incident on the second semiconductor layer (B) is higher than the intensity of light in the second wavelength region incident on the first semiconductor layer (A).