The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2014
Filed:
Jan. 10, 2011
Kuniaki Kawabe, Ichihara, JP;
Masayoshi Sutou, Ichihara, JP;
Toshiyuki Itou, Ichihara, JP;
Mai Kurihara, Ichihara, JP;
Akinori Etoh, Ichihara, JP;
Shinichirou Asao, Ichihara, JP;
Kenji Sugimura, Iwakuni, JP;
Hiroshi Hoya, Chiba, JP;
Koji Matsunaga, Yokohama, JP;
Yoji Hayakawa, Chiba, JP;
Kunihiko Mizumoto, Chiba, JP;
Kuniaki Kawabe, Ichihara, JP;
Masayoshi Sutou, Ichihara, JP;
Toshiyuki Itou, Ichihara, JP;
Mai Kurihara, Ichihara, JP;
Akinori Etoh, Ichihara, JP;
Shinichirou Asao, Ichihara, JP;
Kenji Sugimura, Iwakuni, JP;
Hiroshi Hoya, Chiba, JP;
Koji Matsunaga, Yokohama, JP;
Yoji Hayakawa, Chiba, JP;
Kunihiko Mizumoto, Chiba, JP;
Mitsui Chemicals, Inc., Tokyo, JP;
Abstract
[Object] To provide a resin composition with excellent mold releasability and blocking resistance. [Solution] A resin composition containing a 4-methyl-1-pentene polymer includes 0.01 to 10 parts by mass of a 4-methyl-1-pentene polymer (B) per 100 parts by mass of at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins, wherein the 4-methyl-1-pentene polymer (B) has (B1) an intrinsic viscosity [η] of 0.01 or more but less than 0.50 dl/g measured at 135° C. in a decalin solvent.