The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2014
Filed:
Oct. 27, 2009
Takashi Iwamoto, Tokyo, JP;
Yukiyoshi Sasaki, Tokyo, JP;
Mitsuhiro Horio, Tokyo, JP;
Syuuichi Kudou, Tokyo, JP;
Takashi Iwamoto, Tokyo, JP;
Yukiyoshi Sasaki, Tokyo, JP;
Mitsuhiro Horio, Tokyo, JP;
Syuuichi Kudou, Tokyo, JP;
Asahi Kasei Chemicals Corporation, Tokyo, JP;
Abstract
Provided is a polyacetal resin composition obtained from a raw material composition containing a polyacetal resin, a hydrazine derivative, and a compound for lowering the melting point of the hydrazine derivative, wherein a mixture of the hydrazine derivative and the compound satisfies both of the following conditions: T1<T2 and T1<T3, in which T1 is an apex temperature of an endothermic peak of the mixture having a maximum endothermic capacity by, with DSC, heating and cooling the mixture in accordance with a predetermined temperature program and then heating it at a predetermined rate until the mixture fuses; and T2 and T3 represent apex temperatures of endothermic peaks of the hydrazine derivative and the polyacetal resin having a maximum endothermic capacity, respectively by the similar treatment.