The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2014
Filed:
Aug. 30, 2012
Thomas W. Dyer, Pleasant Valley, NY (US);
Daniel C. Edelstein, White Plains, NY (US);
Tze-man Ko, Hopewell Junction, NY (US);
Andrew H. Simon, Fishkill, NY (US);
Wei-tsu Tseng, Hopewell Junction, NY (US);
Thomas W. Dyer, Pleasant Valley, NY (US);
Daniel C. Edelstein, White Plains, NY (US);
Tze-man Ko, Hopewell Junction, NY (US);
Andrew H. Simon, Fishkill, NY (US);
Wei-tsu Tseng, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of forming a metal interconnect structure includes forming a copper line within an interlevel dielectric (ILD) layer; directly doping a top surface of the copper line with a copper alloy material; and forming a dielectric layer over the ILD layer and the copper alloy material; wherein the copper alloy material serves an adhesion interface layer between the copper line and the dielectric layer.