The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2014

Filed:

May. 25, 2012
Applicants:

Jookwon Kim, Changwon-Si, KR;

Gyusang Lee, Changwon-Si, KR;

Minkyu Hwang, Changwon-Si, KR;

Hyunwoo Jun, Changwon-Si, KR;

Seokjae Jeong, Changwon-Si, KR;

Kyungdo Kim, Changwon-Si, KR;

Inventors:

Jookwon Kim, Changwon-Si, KR;

Gyusang Lee, Changwon-Si, KR;

Minkyu Hwang, Changwon-Si, KR;

Hyunwoo Jun, Changwon-Si, KR;

Seokjae Jeong, Changwon-Si, KR;

Kyungdo Kim, Changwon-Si, KR;

Assignee:

LG Electronics Inc., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/73 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present disclosure relates to a mold apparatus, and according to an aspect of the present disclosure, there is provided a mold apparatus including a cavity mold comprising a cavity mold plate formed with a cavity at a front surface thereof and provided with a heating means at an inner portion thereof, and a cooling plate brought into contact with or separated from a rear surface of the cavity mold plate and provided with a cooling means at an inner portion thereof; and a core mold configured to determine the cavity together with the cavity mold plate, wherein the cooling plate is formed with at least two or more divided surfaces.


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