The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2014

Filed:

Jul. 27, 2012
Applicants:

Jong Taek Hwang, Cheongju-si, KR;

Han Choon Lee, Seoul, KR;

OH Jin Jung, Hwaseong-si, KR;

Jin Youn Cho, Gunpo-si, KR;

Inventors:

Jong Taek Hwang, Cheongju-si, KR;

Han Choon Lee, Seoul, KR;

Oh Jin Jung, Hwaseong-si, KR;

Jin Youn Cho, Gunpo-si, KR;

Assignee:

Dongbu Hitek Co., Ltd., Bucheon, KR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/005 (2006.01); H01G 4/228 (2006.01); H01G 4/40 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01G 4/005 (2013.01); H01G 4/228 (2013.01); H01G 4/40 (2013.01);
Abstract

A capacitive device includes a first capacitor including a first wiring layer, a first dielectric film, a first conductive layer, a first insulating layer on the first capacitor, a second capacitor on the first insulating layer including a second conductive layer, a second dielectric film, and a third conductive layer, a second insulating layer on the second capacitor, a second wiring layer on the second insulating layer including first and second connection wires, a first via connecting the first wiring layer to the second conductive layer, a second via connecting the third conductive layer to the second wiring layer, a third via connecting the first connection wire to the first conductive layer, and a fourth via connecting the second connection wire to the first wiring layer.


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