The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
May. 09, 2008
Applicants:
Jun Ishii, Osaka, JP;
Takahiko Yokai, Osaka, JP;
Inventors:
Jun Ishii, Osaka, JP;
Takahiko Yokai, Osaka, JP;
Assignee:
Nitto Denko Corporation, Osaka, JP;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11B 5/48 (2006.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0253 (2013.01); H05K 2201/0969 (2013.01); H05K 1/056 (2013.01); G11B 5/484 (2013.01); H05K 2201/09081 (2013.01); H05K 1/028 (2013.01); H05K 3/4644 (2013.01); G11B 5/486 (2013.01); H05K 2201/09318 (2013.01); H05K 2201/093 (2013.01); H05K 1/0278 (2013.01); H05K 2201/09663 (2013.01);
Abstract
The wired circuit board includes a metal supporting board, a metal foil formed on the metal supporting board, a first insulating layer formed on the metal supporting board so as to cover the metal foil, and a conductive pattern formed on the first insulating layer and having a plurality of wires. The metal foil is arranged along a lengthwise direction of each of the wires so as not to be opposed to part of the wires in a thickness direction and so as to be opposed to a remainder of the wires in the thickness direction.