The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2014

Filed:

Dec. 03, 2012
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Mitsuru Odahara, Kyoto-fu, JP;

Hideaki Matsushima, Kyoto-fu, JP;

Akihiro Ono, Kyoto-fu, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/29 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic component that can be prevented from being mounted on a circuit board with inclination, and a manufacturing method thereof are provided. An electronic component is mountable on a circuit board including a first land and a second land. The electronic component includes outer electrodes on a lower surface of a stack to be arranged along a direction and are connectable to the first land and the second land, respectively. With the electronic component mounted to the circuit board, respective contact surfaces of the outer electrodes to the first land and the second land have a structure being symmetric about a line parallel to the direction, and each respective contact surface is divided into a plurality of portions.


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