The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2014

Filed:

Jun. 10, 2011
Applicants:

Kazuyuki Matsumura, Otsu, JP;

Kanako Sugimoto, Otsu, JP;

Hiroyuki Niwa, Otsu, JP;

Chikara Inagaki, Urayasu, JP;

Inventors:

Kazuyuki Matsumura, Otsu, JP;

Kanako Sugimoto, Otsu, JP;

Hiroyuki Niwa, Otsu, JP;

Chikara Inagaki, Urayasu, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is a photosensitive adhesive composition comprising (A) an alkali-soluble polyimide having particular structural unit(s) and having a particular structure at at least one end of the main chain, (B) a glycidylamine type epoxy compound of a particular structure, (C) a photopolymerizable compound, and (D) a photoinitiator, wherein (A) the alkali-soluble polyimide has a glass transition temperature of 160° C. or higher. The photosensitive adhesive composition has the ability to form patterns with an alkaline developer, excellent thermocompressibility at a low temperature to an irregular substrate after exposure, and a high adhesive strength even at a high temperature.


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