The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
Oct. 07, 2010
Ryota Seno, Tokushima, JP;
Ryota Seno, Tokushima, JP;
Nichia Corporation, Anan-shi, JP;
Abstract
Disclosed are: a semiconductor device that comprises a semiconductor element to which a plurality of wires are bonded, wherein bonding strength of the wires is high and sufficient bonding reliability is achieved; and a method for manufacturing the semiconductor device. Specifically disclosed is a semiconductor device which is characterized by comprising a first wire that has one end bonded onto an electrode and the other end bonded to a second bonding point that is out of the electrode, and a second wire that has one end bonded onto the first wire on the electrode and the other end bonded to a third bonding point that is out of the electrode. The semiconductor device is also characterized in that the bonded portion of the first-mentioned end of the second wire covers at least apart of the upper surface and the lateral surface of the first wire.