The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
Nov. 10, 2011
Applicants:
Chul Min Lee, Gyeongsangnam-do, KR;
Won Hyung Park, Busan, KR;
Kyung Jin Heo, Busan, KR;
Dek Gin Yang, Chungbuk, KR;
Jin Su Yeo, Busan, KR;
Sung Wook Chun, Incheon-si, KR;
Inventors:
Chul Min Lee, Gyeongsangnam-do, KR;
Won Hyung Park, Busan, KR;
Kyung Jin Heo, Busan, KR;
Dek Gin Yang, Chungbuk, KR;
Jin Su Yeo, Busan, KR;
Sung Wook Chun, Incheon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided is a substrate structure including: a base substrate on which a conductive pattern is formed; a first plating layer covering the conductive pattern; and a second plating layer covering the first plating layer, wherein the first plating layer includes an electroless reduction plating layer.