The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
Aug. 02, 2006
Yuki Yamamoto, Otsu, JP;
Jun Harada, Yasu, JP;
Hiroshi Takagi, Otsu, JP;
Katsuro Hirayama, Otsu, JP;
Yuki Yamamoto, Otsu, JP;
Jun Harada, Yasu, JP;
Hiroshi Takagi, Otsu, JP;
Katsuro Hirayama, Otsu, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
In an electronic component, an active chip element and a passive chip element are respectively enclosed within first and second resin layers, which are separately disposed on upper and lower surfaces of a core substrate, respectively. The first resin layer includes a shielding metal film disposed on an upper surface thereof and a first via-hole conductor which connects the shielding metal film with a circuit pattern provided on the core substrate. The second resin layer includes an external-terminal electrode disposed on a lower surface thereof and a second via-hole conductor which connects the external-terminal electrode with a circuit pattern provided on the core substrate.