The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
Aug. 03, 2011
Yao-jun Tsai, Zhongli, TW;
Chen-peng Hsu, Hsinchu, TW;
Kuo-feng Lin, Sanchong, TW;
Hsun-chih Liu, Shulin, TW;
Ji-feng Chen, Taipei, TW;
Hung-lieh HU, Hsinchu, TW;
Chien-jen Sun, Zhubei, TW;
Yao-Jun Tsai, Zhongli, TW;
Chen-Peng Hsu, Hsinchu, TW;
Kuo-Feng Lin, Sanchong, TW;
Hsun-Chih Liu, Shulin, TW;
Ji-Feng Chen, Taipei, TW;
Hung-Lieh Hu, Hsinchu, TW;
Chien-Jen Sun, Zhubei, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A light emitting diode chip, a light emitting diode package structure and a method for forming the same are provided. The light emitting diode chip includes a bonding layer, which has a plurality of voids, or a minimum horizontal distance between a surrounding boundary of the light emitting diode chip and the bonding layer is larger than 0. The light emitting diode chip, the light emitting diode package structure and the method may improve the product yields and enhance the light emitting efficiency.