logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8759865 B1

PDFFull Text
Date of Patent:
Jun. 24, 2014

Filed:

Aug. 03, 2011

Light emitting diode chip, light emitting diode package structure, and method for forming the same

Applicants:

Yao-jun Tsai, Zhongli, TW;

Chen-peng Hsu, Hsinchu, TW;

Kuo-feng Lin, Sanchong, TW;

Hsun-chih Liu, Shulin, TW;

Ji-feng Chen, Taipei, TW;

Hung-lieh HU, Hsinchu, TW;

Chien-jen Sun, Zhubei, TW;

Inventors:

Yao-Jun Tsai, Zhongli, TW;

Chen-Peng Hsu, Hsinchu, TW;

Kuo-Feng Lin, Sanchong, TW;

Hsun-Chih Liu, Shulin, TW;

Ji-Feng Chen, Taipei, TW;

Hung-Lieh Hu, Hsinchu, TW;

Chien-Jen Sun, Zhubei, TW;

Assignee:

Industrial Technology Research Institute, Hsinchu, TW;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Thao P Le

Int. Cl.
CPC ...
H01L 33/20 (2010.01); H01L 33/38 (2010.01); H01L 33/48 (2010.01); H01L 33/10 (2010.01); H01L 33/62 (2010.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/20 (2013.01); H01L 33/0079 (2013.01); H01L 33/38 (2013.01); H01L 33/0095 (2013.01); H01L 33/48 (2013.01); H01L 2224/16225 (2013.01); H01L 33/10 (2013.01);
Abstract

A light emitting diode chip, a light emitting diode package structure and a method for forming the same are provided. The light emitting diode chip includes a bonding layer, which has a plurality of voids, or a minimum horizontal distance between a surrounding boundary of the light emitting diode chip and the bonding layer is larger than 0. The light emitting diode chip, the light emitting diode package structure and the method may improve the product yields and enhance the light emitting efficiency.

Find Patent Forward Citations

Tsai, Yao-Jun. (2014). Light emitting diode chip, light emitting diode package structure, and method for forming the same (U.S. Patent No. 8759865). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8759865

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…