The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
Mar. 03, 2011
Akihiro Fujiwara, Fukuoka-ken, JP;
Takashi Hakuno, Fukuoka-ken, JP;
Tokuhiko Matsunaga, Fukuoka-ken, JP;
Kimitaka Yoshimura, Fukuoka-ken, JP;
Katsufumi Kondo, Fukuoka-ken, JP;
Akihiro Fujiwara, Fukuoka-ken, JP;
Takashi Hakuno, Fukuoka-ken, JP;
Tokuhiko Matsunaga, Fukuoka-ken, JP;
Kimitaka Yoshimura, Fukuoka-ken, JP;
Katsufumi Kondo, Fukuoka-ken, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
According to one embodiment, a semiconductor device includes a substrate and a stacked body on the substrate via a joining metal layer. The stacked body includes a device portion and a peripheral portion. The device portion includes from a bottommost layer to a topmost layer included in the stacked body. The peripheral portion surrounding and provided around the device portion; the peripheral portion is a portion of the bottommost layer to the topmost layer included in the stacked body and includes a portion of a semiconductor layer in contact with the joining metal layer.