The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
Feb. 08, 2012
Andrew J. Debaets, Cupertino, CA (US);
Andrew J. DeBaets, Cupertino, CA (US);
Xilinx, Inc., San Jose, CA (US);
Abstract
According to an embodiment, an die for routing signals in a plurality of metal layers of an integrated circuit device is disclosed. The die comprises a first pair of conductive lines (A andB) having a first reference line and a first signal line, the first reference line having traces and crossover segments in a plurality of metal layers; and second pair of conductive lines (A andB) having a second reference line and a second signal line, the second reference line having traces and crossover segments in the plurality of metal layers which are offset from the traces and crossover segments of the first reference lines; wherein a first signal trace () of the first signal line in a first metal layer is adjacent to a first reference trace () of the first reference line on a first side of the first signal trace and to a second reference trace () of the second reference line on a second side of the first signal trace. A method for routing signals in a plurality of metal layers of an integrated circuit device is also disclosed.