The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
Jan. 27, 2011
Andrey Buryak, Linz, AT;
Albrecht Dix, Linz, AT;
Balakantha Rao Kona, Linz, AT;
Borealis AG, Vienna, AT;
Abstract
A high density polyethylene moulding composition having a multimodal molecular weight distribution, having a density according to ISO 1183 at 23° C. in the range of 945 to 965 kg/mand an MFRaccording to ISO 1133 in the range of 0.05 to 25 g/10 min, said polyethylene moulding composition comprising at least three ethylene polymer fractions having distinct molecular weights: A) 15 to 50 wt % of a low molecular weight ethylene homopolymer fraction with a weight average molecular weight Mw in the range of 15 to 40 kg/mol; B) 15 to 50 wt % of a medium molecular weight ethylene homopolymer fraction with a weight average molecular weight Mw in the range of 70 to 180 kg/mol; and C) 15 to 50 wt % of a high molecular weight ethyleve copolymer fraction with a weight average molecular weight Mw in the range of 200 to 400 kg/mol; and wherein the composition has: a tensile modulus according to ISO 527-2: 1993 measured on compression moulded samples of at least 800 MPa; a Charpy impact strength CIS (23° C.) according to ISO 179:2000 measured on V- notched samples produced by compression moulding of at least 30 kJ/m; and an environmental stress crack resistance ESCR measured as FNCT full notch creep test according to ISO/DIS 16770.3 at 50° C. and 6 MPa of at least 20 h.