The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
Mar. 13, 2013
Applicant:
Henkel Corporation, Rocky Hill, CT (US);
Inventors:
Eric C. Wang, Irvine, CA (US);
Kevin Harris Becker, Cerritos, CA (US);
Qizhuo Zhuo, Irvine, CA (US);
Assignee:
Henkel IP & Holding GmbH, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); C09J 163/02 (2006.01); C09J 163/04 (2006.01); C08L 63/00 (2006.01); C08L 63/02 (2006.01); C08L 63/04 (2006.01); C08G 59/20 (2006.01); C08G 59/22 (2006.01); C08G 59/32 (2006.01); B32B 27/18 (2006.01); B32B 27/38 (2006.01);
U.S. Cl.
CPC ...
Abstract
An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler.