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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8759422 B1

PDFFull Text
Expired
Date of Patent:
Jun. 24, 2014

Filed:

Mar. 13, 2013

B-stageable and skip-curable wafer back side coating adhesives

Applicant:

Henkel Corporation, Rocky Hill, CT (US);

Inventors:

Eric C. Wang, Irvine, CA (US);

Kevin Harris Becker, Cerritos, CA (US);

Qizhuo Zhuo, Irvine, CA (US);

Assignee:

Henkel IP & Holding GmbH, Duesseldorf, DE;

Attorney:

Steven C. Bauman

Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
C09J 163/00 (2006.01); C09J 163/02 (2006.01); C09J 163/04 (2006.01); C08L 63/00 (2006.01); C08L 63/02 (2006.01); C08L 63/04 (2006.01); C08G 59/20 (2006.01); C08G 59/22 (2006.01); C08G 59/32 (2006.01); B32B 27/18 (2006.01); B32B 27/38 (2006.01);
U.S. Cl.
CPC ...
Abstract

An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler.

Find Patent Forward Citations

Wang, Eric. (2014). B-stageable and skip-curable wafer back side coating adhesives (U.S. Patent No. 8759422). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8759422

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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