The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
Aug. 06, 2009
Gian Pietro Vanalli, Bergamo, IT;
Giovanni Campardo, Bergamo, IT;
Aldo Losavio, Bergamo, IT;
Paolo Pulici, Lagnano, IT;
Pier Paolo Stoppino, Milan, IT;
Gian Pietro Vanalli, Bergamo, IT;
Giovanni Campardo, Bergamo, IT;
Aldo Losavio, Bergamo, IT;
Paolo Pulici, Lagnano, IT;
Pier Paolo Stoppino, Milan, IT;
STMicroelectronics S.r.l., Agrate Brianza (MB), IT;
Politecnico di Milano, Milan, IT;
Abstract
A method for manufacturing solder bumps for through vias in a substrate having a first surface and a second surface opposed to each other. The method includes the steps of forming a blind hole extending in the substrate from the first surface for each via and filling each blind hole with a conductive filler; a deepest part of each filler includes a bump portion made of a solder material. The method further includes the step of removing a part of the substrate extending from the second surface to have at least the bump portions protrude from the substrate. The non-protruding part of each filler defines the corresponding via and the bump portion defines the corresponding bump.