The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
Dec. 28, 2010
Applicants:
Hideyuki Imai, Aichi-ken, JP;
Yoshinori Nagamori, Aichi-ken, JP;
Shinichi Takeda, Aichi-ken, JP;
Inventors:
Assignee:
Toyoda Gosei Co., Ltd., Aichi-pref., JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05H 1/00 (2006.01); B05D 3/00 (2006.01); B29C 71/02 (2006.01); B29C 71/04 (2006.01); B29C 45/14 (2006.01); B29C 65/00 (2006.01); B29K 81/00 (2006.01); B29K 705/02 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14311 (2013.01); B29C 66/71 (2013.01); B29K 2081/04 (2013.01); B29K 2705/02 (2013.01);
Abstract
The metal part is one where a carboxyl group or an amino group, or a hydroxyl group is imparted onto the surface. On the other hand, the resin part is one into which an adhesiveness modifier containing an epoxy group is blended. A process for producing a composite of metal and resin, wherein the metal part and the resin part are bonded by interaction of the carboxyl group or the amino group, or the hydroxyl group with the epoxy group.